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Cooler Master
Coolermaster ThermalFusion 400 Thermal Compound
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
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Product Description
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Product Features
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Curing
- Non-Corrosive
- Easy Application with Included Razor Blade
Customer Reviews
Average Rating (2 Customers)
Reviews
"Excellent product" by Robert F. -
If you want great thermal paste buy this. My GPU load temps went down from 68C to 52C. Also great service from LOOT!
Product Details
General
Brand | Cooler Master |
Availability | Supplier out of stock. If you add this item to your wish list we will let you know when it becomes available. |
Package Dimensions | 190 x 100 x 20mm (L x W x T) |
Categories | |
LSN | X61-MP7-HPD-2 |
Model Number | RG-TF4-TGU1-GP |
Type | Thermal Compound |
Other Features
Specific Gravity | 3.5 |
Thermal Conductivity (W/mK) | 2.89 |
Volume | 4g |
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