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Functional Molecular Silicon Compounds II - Low Oxidation States (Hardcover, 2014 ed.) Loot Price: R4,680
Discovery Miles 46 800
You Save: R1,073 (19%)
Functional Molecular Silicon Compounds II - Low Oxidation States (Hardcover, 2014 ed.): David Scheschkewitz

Functional Molecular Silicon Compounds II - Low Oxidation States (Hardcover, 2014 ed.)

David Scheschkewitz

Series: Structure and Bonding, 156

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List price R5,753 Loot Price R4,680 Discovery Miles 46 800 | Repayment Terms: R435 pm x 12* You Save R1,073 (19%)

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The series Structure and Bonding publishes critical reviews on topics of research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant. The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors. Readership: research scientists at universities or in industry, graduate students Special offer for all customers who have a standing order to the print version of Structure and Bonding, we offer free access to the electronic volumes of the Series published in the current year via SpringerLink.

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Series: Structure and Bonding, 156
Release date: February 2014
First published: 2014
Editors: David Scheschkewitz
Dimensions: 235 x 155 x 20mm (L x W x T)
Format: Hardcover
Pages: 232
Edition: 2014 ed.
ISBN-13: 978-3-319-03733-2
Categories: Books > Science & Mathematics > Chemistry
Books > Professional & Technical > Industrial chemistry & manufacturing technologies
Books > Science & Mathematics > Chemistry > Inorganic chemistry
Books > Science & Mathematics > Chemistry > Organic chemistry
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry
Books > Science & Mathematics > Chemistry > Inorganic chemistry > General
Books > Science & Mathematics > Chemistry > Organic chemistry > General
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > Pharmaceutical technology
LSN: 3-319-03733-1
Barcode: 9783319037332

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