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Chemical-Mechanical Planarization: Volume 867 - Integration, Technology and Reliability (Hardcover, illustrated edition) Loot Price: R539
Discovery Miles 5 390
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Chemical-Mechanical Planarization: Volume 867 - Integration, Technology and Reliability (Hardcover, illustrated edition): E. C....
Chemical-Mechanical Planarization: Volume 867 - Integration, Technology and Reliability (Hardcover, illustrated edition): E. C....

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Chemical-Mechanical Planarization: Volume 867 - Integration, Technology and Reliability (Hardcover, illustrated edition)

E. C. Johns, A. Kumar, J. A Lee, Y. S. Obeng, I Vos

Series: MRS Proceedings

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Loot Price R539 Discovery Miles 5 390

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Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

General

Imprint: Materials Research Society
Country of origin: United States
Series: MRS Proceedings
Release date: July 2005
First published: July 2005
Editors: E. C. Johns • A. Kumar • J. A Lee • Y. S. Obeng • I Vos
Format: Hardcover - Cloth over boards
Pages: 302
Edition: illustrated edition
ISBN-13: 978-1-55899-820-9
Barcode: 9781558998209
Categories: Books > Professional & Technical > Technology: general issues > Engineering: general
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LSN: 1-55899-820-9

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