This book presents a wide-band and technology independent,
SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D
integrated circuits. This model accounts for a variety of effects,
including skin effect, depletion capacitance and nearby contact
effects. Readers will benefit from in-depth coverage of concepts
and technology such as 3D integration, Macro modeling, dimensional
analysis and compact modeling, as well as closed form equations for
the through silicon via parasitics. Concepts covered are
demonstrated by using TSVs in applications such as a spiral
inductor and inductive-based communication system and bandpass
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