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Failure Modes and Mechanisms in Electronic Packages (Hardcover)
P. Singh, Puligandla ViswanadhamWith the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
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Add to wish listProduct Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
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Product Details
General
Imprint | Chapman and Hall |
Country of origin | United Kingdom |
Release date | November 1997 |
Availability | Expected to ship within 10 - 15 working days |
First published | 1998 |
Authors | P. Singh, Puligandla Viswanadham |
Dimensions | 235 x 155 x 22mm (L x W x T) |
Format | Hardcover |
Pages | 370 |
ISBN-13 | 978-0-412-10591-3 |
Barcode | 9780412105913 |
Categories | |
LSN | 0-412-10591-8 |
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