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Characterization of Integrated Circuit Packaging Materials (Electronic book text)
Characterization of Integrated Circuit Packaging Materials (Electronic book text): Thomas Moore

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Characterization of Integrated Circuit Packaging Materials (Electronic book text)

Thomas Moore

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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: -- General overview of IC package reliability testing -- Characterization for the electrical performance of IC packages -- Understanding surface characteristics and interfaces for thermal management -- Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.

General

Imprint: Momentum Press
Country of origin: United States
Release date: 2010
Authors: Thomas Moore
Format: Electronic book text
Pages: 294
ISBN-13: 978-1-283-89568-2
Categories: Books > Professional & Technical > Electronics & communications engineering
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
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LSN: 1-283-89568-4
Barcode: 9781283895682

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