The gallium arsenide (GaAs) circuits in advanced communication
application have been considered to profoundly supersede the
conventional silicon-based counterpart. Great improvements in the
packaging of GaAs devices are needed to overcome the imminent
handicap of its fragile characteristic; Thin die represents the
mainstream for IC packages to achieve the goal of manufacturing
compact and light products with higher functionality. These trends
tend to challenge the existing infrastructure, henceforth; the
creative design in connection with a unique die bonder in
fabrication has been presented in this book. The general process to
pick up a die was comprehensively investigated and then analyzed
with computer simulations. Experiments were conducted to verify the
simulation results. The die cracks due to the ejecting needle; and
the effects of parameter were analyzed by means of Taguchi Method.
With this procedure, not only the parameters could be optimized but
also the production yield was promoted. Besides, this method could
be easily modified to simulate other type of die bonders with
different mechanisms; even a new procedure could be derived for the
next generational die bonder.
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