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Books > Professional & Technical > Mechanical engineering & materials > Mechanical engineering

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Pick-Up Process Analysis of a Die Bonder (Paperback) Loot Price: R1,097
Discovery Miles 10 970
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Pick-Up Process Analysis of a Die Bonder (Paperback): Yeong-Jyh Lin, Sheng-Jye Hwang

Pick-Up Process Analysis of a Die Bonder (Paperback)

Yeong-Jyh Lin, Sheng-Jye Hwang

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Loot Price R1,097 Discovery Miles 10 970 | Repayment Terms: R100 pm x 12*

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The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

General

Imprint: VDM Verlag Dr. Mueller E.K.
Country of origin: Germany
Release date: April 2008
First published: April 2008
Authors: Yeong-Jyh Lin • Sheng-Jye Hwang
Dimensions: 229 x 152 x 7mm (L x W x T)
Format: Paperback - Trade
Pages: 136
ISBN-13: 978-3-639-00034-4
Categories: Books > Professional & Technical > Mechanical engineering & materials > Mechanical engineering > General
LSN: 3-639-00034-X
Barcode: 9783639000344

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