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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Hardcover, 2015 ed.): Khaled Salah, Yehea I. Ismail, Alaa El-Rouby Arbitrary Modeling of TSVs for 3D Integrated Circuits (Hardcover, 2015 ed.)
Khaled Salah, Yehea I. Ismail, Alaa El-Rouby
R3,085 R2,389 Discovery Miles 23 890 Save R696 (23%) Shipped within 7 - 12 working days

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering."

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Paperback, Softcover reprint of the original 1st ed. 2015): Khaled... Arbitrary Modeling of TSVs for 3D Integrated Circuits (Paperback, Softcover reprint of the original 1st ed. 2015)
Khaled Salah, Alaa El-Rouby
R2,045 Discovery Miles 20 450 Out of stock

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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