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Advances in Thermal Modelling of Electronic Components and Systems v. 3 (Paperback)
This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov
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Product Description
This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov
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Product Details
General
Imprint | American Society Of Mechanical Engineers,U.S. |
Country of origin | United States |
Release date | August 1998 |
Availability | Supplier out of stock. If you add this item to your wish list we will let you know when it becomes available. |
First published | 1998 |
Dimensions | 234 x 160 x 30mm (L x W x T) |
Format | Paperback |
Pages | 420 |
ISBN-13 | 978-0-7918-0065-2 |
Barcode | 9780791800652 |
Categories | |
LSN | 0-7918-0065-2 |
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