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Implantable Microtechnologies for the Brain - Packaging and Interconnects (Hardcover, 2013)
This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.
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Product Description
This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.
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Product Details
General
Imprint | Springer-Verlag New York |
Country of origin | United States |
Release date | October 2015 |
Availability | Supplier out of stock. If you add this item to your wish list we will let you know when it becomes available. |
First published | 2016 |
Editors | Jit Muthuswamy |
Dimensions | 235 x 155mm (L x W) |
Format | Hardcover |
Pages | 200 |
Edition | 2013 |
ISBN-13 | 978-1-4419-8519-4 |
Barcode | 9781441985194 |
Categories | |
LSN | 1-4419-8519-0 |
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