This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.
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This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.
Imprint | Springer-Verlag |
Country of origin | Austria |
Release date | September 2007 |
Availability | Expected to ship within 10 - 15 working days |
First published | 2007 |
Editors | Tibor Grasser, Siegfried Selberherr |
Dimensions | 244 x 170 x 24mm (L x W x T) |
Format | Mixed media product |
Pages | 463 |
ISBN-13 | 978-3-211-72860-4 |
Barcode | 9783211728604 |
Categories | |
LSN | 3-211-72860-0 |