0
Your cart

Your cart is empty

Books > Professional & Technical > Industrial chemistry & manufacturing technologies

Not currently available

Advances in Cmp/Polishing Technologies for the Manufacture of Electronic Devices (Electronic book text)
Advances in Cmp/Polishing Technologies for the Manufacture of Electronic Devices (Electronic book text): Toshiro Doi, Ioan D...
Advances in Cmp/Polishing Technologies for the Manufacture of Electronic Devices (Electronic book text): Toshiro Doi, Ioan D...

Share your images

Advances in Cmp/Polishing Technologies for the Manufacture of Electronic Devices (Electronic book text)

Toshiro Doi, Ioan D Marinescu, Syuhei Kurokawa

 (sign in to rate)

Bookmark and Share

We have no sources for this product at present. If you add this to your wishlist we will let you know should it become available to order.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering.

Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments.

The authors bring together the latest innovations and research from the USA and Japan.

General

Imprint: William Andrew Publishing
Country of origin: United States
Release date: May 2014
Editors: Toshiro Doi • Ioan D Marinescu • Syuhei Kurokawa
Format: Electronic book text
Pages: 330
ISBN-13: 978-1-4377-7860-1
Barcode: 9781437778601
Categories: Promotions
Books > Professional & Technical > Environmental engineering & technology
Books > Professional & Technical > Environmental engineering & technology > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science
Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Industrial chemistry & manufacturing technologies
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General
LSN: 1-4377-7860-7

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!

Loyalty partners