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Status
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Format
Hardcover
Paperback
Author / Contributor
Benjamin Lee
John Lau
John Lau Cfp(r)
Matthew Lau Cfp(r)
Publisher
Bloomsbury Visual Arts
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Showing 8 Results in Books
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Thermal Stress and Strain in Microelectronics Packaging (Paperback, Softcover reprint of the original 1st ed. 1993)
R
4,665
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Basics Fashion Design 09: Designing Accessories - Exploring the design and construction of bags, shoes, hats and jewellery (Paperback)
John Lau
R
929
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The Broth of Oblivion (Paperback)
Illustrated by John Lau
,
Benjamin Lee
R
313
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A Race Between Time and Money - Strategies for a Successful Retirement (Paperback)
John Lau Cfp(r)
,
Matthew Lau Cfp(r)
R
441
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Textomancy (Paperback)
Illustrated by John Lau
,
Benjamin Lee
R
204
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3D IC Integration and Packaging (Hardcover, Ed)
John Lau
R
5,831
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Through-Silicon Vias for 3D Integration (Hardcover, Ed)
John Lau
R
4,799
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Hardcover, Ed)
John Lau
R
3,788
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