BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs (Paperback)

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BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia. Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.

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Product Description

BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia. Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.

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Product Details

General

Imprint

Woodhead Publishing Ltd

Country of origin

United States

Series

Woodhead Publishing Series in Electronic and Optical Materials

Release date

May 2023

Availability

Expected to ship within 12 - 17 working days

First published

2023

Authors

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Dimensions

229 x 152mm (L x W)

Format

Paperback

Pages

325

ISBN-13

978-0-323-85677-5

Barcode

9780323856775

Categories

LSN

0-323-85677-2



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