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Wire Bonding in Microelectronics (Electronic book text, 3rd ed.)
George Harman- George Harman is a nationally recognized expert on wire bonding
- New to this edition: new coverage of fine-pitch wire bonds, low-looping bonds, wafer-level bumping, copper metallization, bonding in plastic packages, and key reliability tests
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Product Description
- George Harman is a nationally recognized expert on wire bonding
- New to this edition: new coverage of fine-pitch wire bonds, low-looping bonds, wafer-level bumping, copper metallization, bonding in plastic packages, and key reliability tests
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Product Details
General
Imprint | McGraw-Hill Education |
Country of origin | United States |
Release date | June 2009 |
Availability | We don't currently have any sources for this product. If you add this item to your wish list we will let you know when it becomes available. |
Authors | George Harman |
Format | Electronic book text - Windows |
Pages | 336 |
Edition | 3rd ed. |
ISBN-13 | 978-0-07-164265-1 |
Barcode | 9780071642651 |
Categories | |
LSN | 0-07-164265-X |
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