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Proceedings 47th Electronic Components and Technologies Conference (Ectc), 1997 (Paperback)
IEEE Components Packaging & Manufacturing Technology SocietyThe papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported."
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Product Description
The papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported."
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Product Details
General
Imprint | I.E.E.E.Press |
Country of origin | United States |
Release date | May 1997 |
Availability | We don't currently have any sources for this product. If you add this item to your wish list we will let you know when it becomes available. |
Editors | Institute of Electrical & Electronics Engineers |
Authors | IEEE Components Packaging & Manufacturing Technology Society |
Dimensions | 279 x 216mm (L x W) |
Format | Paperback |
Volumes | 2 |
Pages | 1300 |
ISBN-13 | 978-0-7803-3857-9 |
Barcode | 9780780338579 |
Categories | |
LSN | 0-7803-3857-X |
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