It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
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It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Imprint | Wiley-VCH Verlag GmbH |
Country of origin | Germany |
Release date | August 2008 |
Availability | Supplier out of stock. If you add this item to your wish list we will let you know when it becomes available. |
First published | October 2008 |
Editors | Philip E. Garrou, Christopher Bower, Peter Ramm |
Dimensions | 248 x 130 x 54mm (L x W x T) |
Format | Hardcover |
Pages | 798 |
ISBN-13 | 978-3-527-32034-9 |
Barcode | 9783527320349 |
Categories | |
LSN | 3-527-32034-2 |